Hohentengen, Germany

Joachim Buch

This inventor holds 1 USPTO granted patent. Top assignee: Shipley Company LLC. Active years: 2005.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Joachim Buch. Retrieved from https://idiyas.com/inventor/joachim-buch

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 196(Granted Patents)


Company Filing History:


Years Active: 2005

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1 patent (USPTO):Explore Patents

Title: Innovations by Joachim Buch in Electroless Plating Processes

Introduction

Joachim Buch is an accomplished inventor based in Hohentengen, Germany. He has made significant contributions to the field of electroless plating processes, which are essential in various industrial applications. His innovative approach has led to the development of a unique patent that enhances the efficiency and effectiveness of metal deposition on polymer surfaces.

Latest Patents

Joachim Buch holds a patent for electroless plating processes. This invention includes processes for combined polymer surface treatment and metal deposition. The processes involve forming an aqueous solution containing a metal activator, such as an oxidized species of silver, cobalt, ruthenium, cerium, iron, manganese, nickel, rhodium, or vanadium. The activator can be oxidized to a higher oxidation state electrochemically. Exposing a part to be plated, such as an organic resin or a printed circuit board substrate, to the solution generates reactive hydroxyl species, which texture the polymer surface. This texturing facilitates good plated metal adhesion. Sufficient time is allowed for both surface texturing and for the oxidized metal activator to adsorb onto the part. The part is then contacted with a reducing agent capable of reducing the metal activator to a lower ionic form or a lower oxidation state. This reduction can result in the formation of metallic catalytic material over the surface of the part. The reduced metal activator can then catalyze the electroless deposition of metal, such as copper, from the solution by contacting the part with the plating solution. Joachim Buch's patent represents a significant advancement in the field of electroless plating.

Career Highlights

Joachim Buch is associated with Shipley Company LLC, where he applies his expertise in innovative plating processes. His work has contributed to the company's reputation for excellence in the field of materials science and engineering. With a focus on practical applications, Buch's inventions have the potential to revolutionize the way metal is deposited on various substrates.

Collaborations

Joachim Buch has collaborated with notable colleagues, including Deborah V. Hirst and Mark A. Poole. These collaborations have fostered an environment of innovation and creativity, leading to advancements in their respective fields.

Conclusion

Joachim Buch's contributions to electroless plating processes exemplify the spirit of innovation in the field of materials science. His

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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