Jlin-Fuh Yau

Title: Jlin-Fuh Yau: Innovator in Ceramic Adhesion Technology

Introduction

Jlin-Fuh Yau is a notable inventor based in Taoyuan, Taiwan. He has made significant contributions to the field of materials science, particularly in improving the adhesion between ceramic carriers and thick film circuits. His innovative approach has the potential to enhance the performance and reliability of electronic devices.

Latest Patents

Jlin-Fuh Yau holds a patent for a method aimed at improving adhesion between ceramic carriers and thick film circuits. The patent, titled "Method for improving adhesion between ceramic carrier and thick film circuit," focuses on accelerating the formation of a ceramic-metal eutectic phase through solid-phase diffusion bonding under a positive atmosphere. This method involves printing a metallic conductive slurry on the ceramic surface to create a circuit pattern, followed by controlled heating in an inert gas atmosphere. The resulting eutectic phase significantly increases adhesion, thereby enhancing the durability of electronic components.

Career Highlights

Yau is affiliated with the National Chung Shan Institute of Science and Technology, where he has been instrumental in advancing research in materials engineering. His work has not only contributed to academic knowledge but also has practical applications in the electronics industry.

Collaborations

Throughout his career, Jlin-Fuh Yau has collaborated with esteemed colleagues, including Chia-Ting Lin and Chung-Yen Lu. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Jlin-Fuh Yau's contributions to the field of ceramic adhesion technology exemplify the impact of innovative thinking in materials science. His patented methods are paving the way for advancements in electronic device manufacturing, showcasing the importance of research and development in this critical area.