Company Filing History:
Years Active: 2025
Title: Jiyeong Kim: Innovator in Semiconductor Packaging
Introduction: Jiyeong Kim is a prominent inventor based in Anyang-si, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work focuses on enhancing the performance and reliability of semiconductor packages.
Latest Patents: Jiyeong Kim holds a patent for a semiconductor package that includes underfill and a method of forming the same. This semiconductor package features a first semiconductor chip positioned on a lower structure. A first underfill is strategically placed between the first semiconductor chip and the lower structure. The first underfill consists of a first portion adjacent to the center region of the first semiconductor chip and a second portion adjacent to the edge region. Notably, the second portion has a higher degree of cure than the first portion. Additionally, a plurality of inner connection terminals is located between the first semiconductor chip and the lower structure, extending within the first underfill. This innovative design enhances the overall performance of semiconductor packages.
Career Highlights: Jiyeong Kim is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. His work at Samsung has allowed him to collaborate with some of the brightest minds in technology.
Collaborations: One of his notable coworkers is Okseon Yoon, with whom he has likely shared insights and expertise in semiconductor innovations.
Conclusion: Jiyeong Kim's contributions to semiconductor packaging demonstrate his commitment to advancing technology in this critical field. His innovative patent reflects his expertise and dedication to improving semiconductor performance.