This inventor holds 1 USPTO granted patent. Top assignee: Huawei Technologies Co., Limited. Active years: 2024.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2024
Title: Jiye Xu - Innovator in Chip Heat Dissipation Technologies
Introduction
Jiye Xu is a prominent inventor based in Dongguan, China. He has made significant contributions to the field of chip heat dissipation technologies. His innovative work focuses on improving the efficiency and performance of electronic devices.
Latest Patents
Jiye Xu holds a patent for a "Chip and manufacturing method thereof, and electronic device." This invention provides a chip that includes a die and a thermal conductive sheet. The active surface of the die is connected to the thermal conductive sheet using a first bonding layer. This design allows heat generated at high-temperature areas on the die's active surface to be quickly conducted and dispersed. As a result, temperatures on the active surface are evenly distributed, preventing excessively high local temperatures that could affect the chip's performance.
Career Highlights
Jiye Xu is currently employed at Huawei Technologies Co., Limited, where he continues to develop innovative solutions in the field of electronics. His work has garnered attention for its practical applications in enhancing device reliability and efficiency.
Collaborations
Some of Jiye Xu's notable coworkers include Xiaoyun Wei and Xing Fu. Their collaborative efforts contribute to the advancement of technology within their organization.
Conclusion
Jiye Xu's contributions to chip heat dissipation technologies exemplify the importance of innovation in the electronics industry. His patent reflects a commitment to improving device performance and reliability.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
