Incheon, South Korea

Jiwon Lee

This inventor holds 4 USPTO granted patents and 2 published patent applications. Top assignees: Samsung Bioepis Co., Ltd., Lg Electronics Inc., Lg Magna E-Powertrain Co., Ltd.. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiwon Lee. Retrieved from https://idiyas.com/inventor/jiwon-lee-khh4wl7z

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4 

% Patents Active = 50.0

Average Co-Inventor Count = 2.3

ph-index = 2

Forward Citations = 26(Granted Patents)


Company Filing History:


Years Active: 2020-2026

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4 patents (USPTO):Explore Patents

Title: Jiwon Lee: Innovator in Packaging Solutions

Introduction

Jiwon Lee is a notable inventor based in Incheon, South Korea. He has made significant contributions to the field of packaging through his innovative designs. With a total of two patents to his name, Jiwon is recognized for his creativity and problem-solving skills in the industry.

Latest Patents

Jiwon's latest patent focuses on a box for packaging. This invention aims to enhance the efficiency and sustainability of packaging solutions. His work reflects a commitment to improving product presentation and protection during transportation.

Career Highlights

Jiwon Lee is currently employed at Samsung Bioepis Co., Ltd., a leading biopharmaceutical company. His role at Samsung allows him to apply his inventive skills in a dynamic and challenging environment. His contributions have been instrumental in advancing the company's packaging strategies.

Collaborations

Jiwon collaborates with Dongbo Choi, a talented female coworker. Together, they work on innovative projects that aim to push the boundaries of packaging technology.

Conclusion

Jiwon Lee is an inspiring inventor whose work in packaging has the potential to impact various industries. His dedication to innovation and collaboration highlights the importance of teamwork in achieving groundbreaking solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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