Company Filing History:
Years Active: 2017
Title: Innovations by Jiuan Wei in Silicon Bonding Technology
Introduction
Jiuan Wei is an accomplished inventor based in Springboro, OH, known for his significant contributions to the field of silicon bonding technology. With a focus on enhancing the methods for directly bonding silicon materials, Wei has developed innovative techniques that have the potential to impact various industries.
Latest Patents
Jiuan Wei holds a patent for "Methods for directly bonding silicon to silicon or silicon carbide to silicon carbide." This patent describes a method for bonding a first silicon part to a second silicon part by arranging them in direct physical contact within a thermal insulating structure. The process involves controlling the pressure and temperature within the structure to predetermined levels, allowing for effective bonding during a specified process period. The temperature range for this bonding process is set between 1335°C and 1414°C, showcasing the precision required for successful implementation.
Career Highlights
Wei is currently employed at Lam Research Corporation, where he applies his expertise in silicon bonding technology. His work at Lam Research has positioned him as a key player in advancing semiconductor manufacturing processes. His innovative approach to bonding silicon parts has garnered attention within the industry, highlighting his role as a forward-thinking inventor.
Collaborations
Jiuan Wei collaborates with Jihong John Chen, a fellow professional in the field. Their partnership exemplifies the importance of teamwork in driving innovation and achieving breakthroughs in technology.
Conclusion
Jiuan Wei's contributions to silicon bonding technology reflect his dedication to innovation and excellence. His patent and work at Lam Research Corporation demonstrate the impact of his inventions on the industry.