This inventor holds 1 USPTO granted patent and 4 published patent applications. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Jitaek Oh: Semiconductor Packaging Inventor
Introduction
Jitaek Oh is an inventor based in Suwon, South Korea, associated with Samsung Electronics Co., Ltd. His work includes a patented design for a strip substrate used in semiconductor packaging.
Latest Patents
Oh is credited with 1 patent, titled “Strip Substrate and Semiconductor Package Including the Same.” The invention describes a dielectric layer divided into a unit region and a saw-line region. A saw-line pattern is positioned on the saw-line region, with a conductive dummy pattern extending toward the unit region. The unit region contains power and ground patterns whose lateral surfaces are arranged in relation to the saw-line and conductive dummy patterns.
Career Highlights
Oh’s patent focuses on the layout of substrate patterns in semiconductor packages. The design specifies how the power and ground patterns relate to nearby structures, including the saw-line pattern and conductive dummy pattern.
Collaborations
The provided information identifies Hyoungjoon Kim and Jinmo Kwon as Oh’s coworkers. It does not specify whether they collaborated with him on this patent.
Conclusion
Jitaek Oh’s recorded patent reflects work on strip-substrate design for semiconductor packaging at Samsung Electronics Co., Ltd.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile