Pardubice, Czechia

Jirí Kasík

This inventor holds 1 USPTO granted patent. Top assignee: Outdoor Wireless Networks LLC. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jirí Kasík. Retrieved from https://idiyas.com/inventor/jirí-kasík

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jirí Kasík: Inventor of a PIM-Robust Phasing Line Short-Circuit Design.

Introduction

Jirí Kasík is an inventor associated with Pardubice, Czech Republic. His listed patent concerns a design intended to make a phasing-line short circuit robust against passive intermodulation (PIM).

Latest Patents

Kasík is credited with 1 patent: “PIM Robust Phasing Line Short Circuit Design.” The patent describes a system with a phasing line positioned in a groove. A shorting component couples the phasing line to an interior surface of the groove, while a securing component holds the line against the shorting component. A pressure application component presses in opposite directions against the groove and securing component, helping maintain the connections and the shorting component’s contact with the groove.

Career Highlights

The available information associates Kasík with Outdoor Wireless Networks LLC. His listed patent focuses on a mechanical arrangement for securing a phasing line and shorting component, with the aim of supporting a PIM-robust design.

Collaborations

Martin Kufa and Erik Madle are identified as Kasík’s coworkers. The available information does not specify their roles in the patent or describe particular collaborative contributions.

Conclusion

Jirí Kasík’s listed invention addresses the secure assembly of a phasing-line short circuit, combining a groove, shorting component, securing component, and applied pressure to support reliable contact.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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