This inventor holds 1 USPTO granted patent. Top assignee: Toyo Seikan Kaisha, Ltd.. Active years: 2013.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2013
Title: Innovator Jiro Iida: Pioneering Laser Welding in Packing Technologies
Introduction: Jiro Iida, an inventive mind thriving in Yokohama, Japan, has made significant contributions to the field of packaging technologies. With a single patent to his name, Iida's innovation reflects a remarkable intersection of materials engineering and laser technology, showcasing the practical applications of scientific advances in everyday products.
Latest Patents: Iida's notable patent is titled "Packing body sealed by laser welding and method of sealing the same." This invention entails a packing body constructed from a laminated material combined with a sealing member. Notably, it incorporates a base material layer, a thermoplastic resin layer containing iron powder, and a thermoplastic resin layer that allows laser beams to penetrate. The innovative aspect of this patent lies in its ability to effectively utilize iron powder, traditionally used as an oxygen absorber in packing containers, while simultaneously optimizing the laser welding process to seal the surfaces of the packing body and sealing member.
Career Highlights: Jiro Iida has established himself professionally at Toyo Seikan Kaisha, Ltd., a company renowned for its innovative packaging solutions. Iida's work contributes to various advancements in the fields of materials science and laser applications, aimed at improving industrial processes and product integrity.
Collaborations: Throughout his career, Iida has collaborated with fellow innovators, including Kiyotaka Shinozaki and Shoichi Inaba. These partnerships have fostered a productive environment for sharing ideas and enhancing the development of state-of-the-art packaging technologies.
Conclusion: Jiro Iida's inventive capabilities have led to significant advancements in packing technologies, particularly through his pioneering work in laser welding. His patent remains a testament to the potential for innovation within the packaging industry, furthering the efficiency and functionality of packaging solutions that benefit various sectors.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
