Jiri Pecen

Title: Innovations of Jiri Pecen in Chemical-Mechanical Polishing

Introduction

Jiri Pecen is a notable inventor based in Palo Alto, California, recognized for his contributions to the field of chemical-mechanical polishing (CMP). With a total of 11 patents to his name, Pecen has developed innovative methods and apparatuses that enhance the efficiency and effectiveness of CMP processes.

Latest Patents

Among his latest patents is a "Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing." This invention provides a sophisticated apparatus and method for monitoring the thickness of a film on a substrate during CMP. The tool features an opening that contains a monitoring window, allowing a film thickness monitor to assess the substrate's film thickness. This information is crucial for determining the end point of the CMP process, as well as for optimizing removal rates and uniformity across the substrate surface.

Another significant patent is the "Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher." This invention includes a linear polishing belt equipped with a flexible monitoring window that creates a monitoring channel. The film thickness monitor, which may include an interferometer, works in conjunction with the monitoring channel to provide critical data for optimizing the CMP process.

Career Highlights

Jiri Pecen has worked with prominent companies in the semiconductor industry, including Lam Research Corporation and Tencor Instruments. His experience in these organizations has allowed him to refine his expertise in CMP technologies and contribute to advancements in the field.

Collaborations

Throughout his career, Pecen has collaborated with talented professionals, including Saket Chadda and Rahul Jairath. These collaborations have fostered innovation and have led to the development of cutting-edge technologies in chemical-mechanical polishing.

Conclusion

Jiri Pecen's work in the field of chemical-mechanical polishing has significantly impacted the industry through his innovative patents and collaborations. His contributions continue to enhance the efficiency and effectiveness of CMP processes, making him a key figure in this technological domain.