Reinach, Switzerland

Jiong Yu

This inventor holds 1 USPTO granted patent. Top assignee: Addivant Switzerland Gmbh. Active years: 2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiong Yu. Retrieved from https://idiyas.com/inventor/jiong-yu-l27d0fx8

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2019

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1 patent (USPTO):Explore Patents

Title: Jiong Yu - Innovator in Additive Granule Technology

Introduction

Jiong Yu is a notable inventor based in Reinach, Switzerland. He has made significant contributions to the field of additive manufacturing, particularly in the development of processes that enhance the quality of granules used in various applications.

Latest Patents

Jiong Yu holds a patent for a process that relates to forming substantially dust-free additive granules. This innovative process is crucial for improving the handling and application of additive materials in manufacturing.

Career Highlights

Currently, Jiong Yu is employed at Addivant Switzerland GmbH, where he applies his expertise in additive technologies. His work focuses on developing solutions that enhance product performance and sustainability in the industry.

Collaborations

Jiong Yu collaborates with esteemed colleagues, including Peter R. Smith and Shengli Gao. Their combined efforts contribute to advancing the field of additive manufacturing and improving product formulations.

Conclusion

Jiong Yu's contributions to the field of additive granule technology demonstrate his commitment to innovation and excellence. His work continues to influence the industry positively, paving the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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