FOSHAN, China

Jinquan Liu

This inventor holds 1 USPTO granted patent. Top assignee: Guangdong Midea Consumer Electric Manufacturing Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jinquan Liu. Retrieved from https://idiyas.com/inventor/jinquan-liu-xf0rfl9j

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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Average Co-Inventor Count = 1.0

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Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jinquan Liu and His Food Processing Machine and Motor Patent.

Introduction

Jinquan Liu is an inventor based in Foshan, China. His work includes a patent for a food processing machine and motor, an invention that combines a cutting-tool assembly with a motor designed to drive it.

Latest Patents

Liu is associated with 1 patent: “Food Processing Machine and Motor.” The patent describes a food processing machine with a base assembly and a cup body assembly that can be mounted on the base. The cup body assembly includes a cutting-tool component, which is rotated by the motor.

The motor has stator and rotor components. The stator is located in the base assembly, and the rotor drives the cutting tool. The patent also specifies the direction of magnetic force lines between and within the stator and rotor, describing how their magnetic poles are arranged along the rotor’s axis and each component’s circumference.

Career Highlights

Liu is associated with Guangdong Midea Consumer Electric Manufacturing Co., Ltd. His patent reflects work on motor design and the integration of powered cutting tools into food-processing equipment.

Collaborations

Liu’s listed coworkers include Xiantang Liang and Jiahao Liu. Their names are associated with his professional and patent-related context.

Conclusion

Jinquan Liu’s patent focuses on the motor and magnetic configuration of a food processing machine, linking its electrical design to the operation of its cutting tool.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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