This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Cyntec Co., Ltd.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Jinping Zhou
Introduction
Jinping Zhou is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of magnetic components, particularly with his innovative designs that enhance thermal conductivity.
Latest Patents
Jinping Zhou holds a patent for a "Magnetic component structure with thermal conductive filler." This invention features a magnetic component structure that includes two magnetic cores forming an inner accommodating space and at least one core opening. The design incorporates two plate portions connected through an inner leg structure and two outer leg structures. A bobbin sleeves the inner leg structure, with a coil winding on the bobbin. The bobbin housing surrounds the bobbin and coil winding, forming a winding opening that faces the core opening. Gaps are created between the encasing structure and the magnetic cores, with a thermal conductive filler positioned between the bobbin and the bobbin housing, encapsulating parts of the coil winding. The cooling surface contacts both the magnetic cores and the thermal conductive filler, which extends outwardly to contact the cooling surface through the openings.
Career Highlights
Jinping Zhou is currently employed at Cyntec Co., Ltd., where he continues to innovate in the field of magnetic components. His work has been instrumental in advancing technologies that require efficient thermal management.
Collaborations
He collaborates with talented coworkers, including Chun-Tiao Liu and Hsieh-Shen Hsieh, who contribute to the development of cutting-edge technologies in their field.
Conclusion
Jinping Zhou's contributions to the field of magnetic components demonstrate his commitment to innovation and excellence. His patent for a magnetic component structure with thermal conductive filler showcases his ability to address complex engineering challenges.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile