This inventor holds 1 USPTO granted patent and 1 published patent application. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Years Active: 2026
Title: Jingyu Moon and Semiconductor Manufacturing Equipment
Introduction
Jingyu Moon is an inventor associated with Suwon, South Korea. His listed patent concerns semiconductor manufacturing equipment designed to support thermal compression bonding.
Latest Patents
Moon’s listed patent, “Semiconductor Manufacturing Equipment,” describes equipment with a main body and bonding head, plus a head heater positioned beneath the head. The heater has a thermal compression surface with recessed negative-pressure channels containing holes. A bonding tool has grooves on the surface that contacts the heater, while its opposite surface contacts a semiconductor chip during thermal compression. The design brings together heating, pressure control, and chip contact in a bonding process. The provided information lists 1 patent for Moon.
Career Highlights
The available information highlights Moon’s work on semiconductor manufacturing equipment, particularly a bonding arrangement that combines a heated surface with negative-pressure channels and a grooved bonding tool. No additional career details were provided.
Collaborations
Moon’s coworker is Cheolan Kwon, who is identified in the provided information as a woman. No further details about their collaboration were provided.
Conclusion
Jingyu Moon’s listed patent focuses on equipment for thermal compression bonding in semiconductor manufacturing, combining a heated bonding head, negative-pressure channels, and a grooved bonding tool.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile