Hong Kong, China

Jing Yang

This inventor holds 1 USPTO granted patent. Top assignee: The Hong Kong Polytechnic University. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jing Yang. Retrieved from https://idiyas.com/inventor/jing-yang-gd975p77

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Jing Yang in Heat Transfer Technology

Introduction

Jing Yang is an accomplished inventor based in Hong Kong, CN. He has made significant contributions to the field of heat transfer technology. His innovative approach has led to the development of a unique heat transfer device that has practical applications in various industries.

Latest Patents

Jing Yang holds a patent for a heat transfer device and system. This device is designed to apply varying temperatures to a portion of an animate body. It comprises a liquid conduit that can be connected to two external liquid sources. The first source establishes a circulation loop for transporting a first liquid, while the second source establishes a loop for a second liquid that has a higher temperature. The liquid conduit can switch between these loops, allowing for precise temperature control.

Career Highlights

Jing Yang is affiliated with The Hong Kong Polytechnic University, where he continues to engage in research and development. His work focuses on advancing heat transfer technologies that can improve efficiency and effectiveness in various applications.

Collaborations

Jing Yang collaborates with Ying Xiong, a fellow researcher. Together, they explore innovative solutions in their field, contributing to the advancement of technology.

Conclusion

Jing Yang's contributions to heat transfer technology exemplify the spirit of innovation. His patent and ongoing research at The Hong Kong Polytechnic University highlight his commitment to advancing this important field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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