Haiyan, China

Jing Yang

This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Danfoss A/s. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jing Yang. Retrieved from https://idiyas.com/inventor/jing-yang-1a061y8a

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations by Jing Yang in Heat Exchanger Technology

Introduction

Jing Yang is an accomplished inventor based in Haiyan, China. He has made significant contributions to the field of heat exchanger technology. His innovative designs aim to improve the efficiency and quality of heat exchangers.

Latest Patents

Jing Yang holds a patent for a connecting pipe assembly and a heat exchanger. This invention includes a pipe and a first flange that extends radially from the outer surface of the pipe. The design features a first insertion pipe section located on one side of the flange, enhancing the overall quality of the heat exchanger. He has 1 patent to his name.

Career Highlights

Jing Yang is currently employed at Danfoss A/S, a company known for its commitment to innovation in energy-efficient solutions. His work at Danfoss A/S allows him to apply his inventive skills in a practical setting, contributing to advancements in technology.

Collaborations

Jing Yang collaborates with Jing Yuan, a talented female coworker. Their partnership fosters a creative environment that encourages the development of new ideas and solutions in their field.

Conclusion

Jing Yang's contributions to heat exchanger technology exemplify the impact of innovative thinking in engineering. His patent and work at Danfoss A/S highlight his commitment to improving energy efficiency and quality in industrial applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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