Suzhou, Japan

Jing Wang

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Tineco Intelligent Technology Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jing Wang. Retrieved from https://idiyas.com/inventor/jing-wang-9gzhaq0q

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jing Wang and a Patent for an Improved Surface Cleaning System.

Introduction

Jing Wang is an inventor associated with Suzhou, Japan, and Tineco Intelligent Technology Co., Ltd. Her patent work includes a surface-cleaning system designed to improve how a floor brush cleans its roller brush cover.

Latest Patents

Wang is associated with 1 patent: “Surface Cleaning System, Surface Cleaning Device and Control Method Thereof.” The invention describes a floor-brush assembly with a housing, roller brush, and cover that together form a cavity for the roller brush. The cover can move between two positions relative to the housing, changing how much it contacts the roller brush. In the first position, the contact area is smaller than in the second position, allowing the roller brush to clean the cover’s inner wall.

Career Highlights

Wang’s listed patent is connected to Tineco Intelligent Technology Co., Ltd. and focuses on a practical cleaning-device mechanism. Its adjustable cover positions support cleaning the cover’s inner surface with the roller brush.

Collaborations

Wang’s listed coworkers include Xiaokang Dong and Jian Sun. The patent information provided does not specify their individual roles in the invention.

Conclusion

Jing Wang’s patent describes an adjustable floor-brush design that uses roller-brush contact to clean the cover’s inner wall, reflecting her contribution to surface-cleaning technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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