This inventor holds 1 USPTO granted patent. Top assignee: Polyflow, Inc.. Active years: 2021.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2021
Title: Innovations of Jing Liu in Thermoplastic Pipe Technology
Introduction
Jing Liu is an accomplished inventor based in Katy, TX (US). He has made significant contributions to the field of thermoplastic pipe technology, particularly in subsea and buried applications. His innovative designs focus on enhancing the performance and reliability of reinforced thermoplastic pipes.
Latest Patents
Jing Liu holds a patent for a "Spoolable reinforced thermoplastic pipe for subsea and buried applications." This invention features a reinforced thermoplastic pipe that includes a polymeric barrier layer formed around a longitudinal axis. It incorporates at least one first non-metallic reinforcement layer designed to carry internal pressure loads, surrounded by a second non-metallic reinforcement layer that manages axial loads. The design also includes a polymeric cover layer and may feature braided reinforcement layers to reduce axial compression forces in constrained applications. Additionally, some embodiments include an interior helical metallic layer, enhancing the pipe's structural integrity.
Career Highlights
Jing Liu is currently employed at Polyflow, Inc., where he continues to develop innovative solutions in the field of thermoplastic materials. His work has been instrumental in advancing the technology used in various applications, particularly in challenging environments.
Collaborations
Jing Liu collaborates with his coworker, Liang Yu, to further enhance their research and development efforts in thermoplastic pipe technology.
Conclusion
Jing Liu's contributions to the field of thermoplastic pipe technology demonstrate his commitment to innovation and excellence. His patent for a spoolable reinforced thermoplastic pipe showcases his ability to address complex engineering challenges effectively.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile