Shanghai, China

Jing Hu

This inventor holds 4 USPTO granted patents and 1 EPO patent. Top assignees: Hewlett-Packard Development Company, L.p., Shanghai Institute of Technology, Spreadtrum Communications (Shanghai) Co., Ltd.. Active years: 2012-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jing Hu. Retrieved from https://idiyas.com/inventor/jing-hu-n4gs6sn1

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 75.0

 

Average Co-Inventor Count = 3.7

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2012-2024

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4 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Jing Hu

Introduction: Jing Hu, a visionary inventor hailing from Shanghai, China, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Jing Hu's latest patents include cutting-edge technologies in the fields of artificial intelligence, renewable energy, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights: Throughout his illustrious career, Jing Hu has been recognized for his exceptional problem-solving skills and creativity, leading to the development of revolutionary products that have transformed industries and improved the lives of many.

Collaborations: Jing Hu has collaborated with leading research institutions, universities, and multinational companies to further his research and bring his inventions to the global market, solidifying his reputation as a respected figure in the innovation landscape.

Conclusion: Jing Hu's relentless pursuit of innovation and his passion for pushing the boundaries of what is possible have established him as a trailblazing inventor, inspiring the next generation of innovators to dream big and create a better future for all.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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