Yorktown Heights, NY, United States of America

Jing Fu

This inventor holds 2 USPTO granted patents. Top assignee: International Business Machines Corporation. Active years: 2019-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jing Fu. Retrieved from https://idiyas.com/inventor/jing-fu-rv4xl981

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 50.0

Average Co-Inventor Count = 8.5

ph-index = 1

Forward Citations = 33(Granted Patents)


Company Filing History:


Years Active: 2019-2025

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2 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Jing Fu - Pioneering Multi-Dimensional Data Models

Introduction:

Jing Fu, a trailblazing inventor based in Yorktown Heights, NY, has made significant contributions in the field of computing with his groundbreaking patent on casual modeling of multi-dimensional hierarchical metric cubes.

Latest Patents:

Jing Fu holds one patent for his innovative work on casual modeling of multi-dimensional hierarchical metric cubes, revolutionizing data structuring and analysis in the digital realm.

Career Highlights:

As a notable figure in the tech industry, Jing Fu is currently affiliated with International Business Machines Corporation (IBM), a renowned technology giant known for its cutting-edge innovations. His role at IBM showcases his expertise and dedication to advancing the frontiers of computing technology.

Collaborations:

Throughout his career, Jing Fu has collaborated with esteemed professionals in the field, including notable coworkers such as Naoki Abe and Michael G Gemmell. These collaborations have not only enriched his professional network but also fostered a culture of innovation and knowledge-sharing.

Conclusion:

In conclusion, Jing Fu's pioneering work in the realm of multi-dimensional data modeling underscores his commitment to pushing the boundaries of technological advancement. His contributions serve as a testament to the transformative power of innovation in shaping the future of computing and data analysis.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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