San Diego, CA, United States of America

Jing Dai

This inventor holds 1 USPTO granted patent and 3 published patent applications and 9 EPO patents. Top assignee: Qualcomm Incorporated. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jing Dai. Retrieved from https://idiyas.com/inventor/jing-dai-wz5tqlwb

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jing Dai: Innovator in Uplink Channel Technology

Introduction

Jing Dai is a prominent inventor based in San Diego, California. She is known for her contributions to the field of telecommunications, particularly in the area of uplink channel technology. With a focus on enhancing communication systems, her work has significant implications for the industry.

Latest Patents

Jing Dai holds a patent titled "Overlap Handling for Uplink Channels with Multi-Slot Transmission Time Interval." This innovation addresses challenges in managing uplink channels, improving the efficiency and reliability of data transmission.

Career Highlights

Dai is currently employed at Qualcomm Incorporated, a leading company in wireless technology. Her role at Qualcomm allows her to work on cutting-edge projects that shape the future of mobile communications. With 1 patent to her name, she has made a notable impact in her field.

Collaborations

Throughout her career, Jing has collaborated with talented individuals such as Hao Xu and Chao Wei. These partnerships have fostered innovation and contributed to the success of various projects within the company.

Conclusion

Jing Dai's work exemplifies the spirit of innovation in telecommunications. Her contributions continue to influence the development of advanced communication technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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