Hsinchu, Taiwan

Jing-Ching Lin


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 1999

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1 patent (USPTO):Explore Patents

Title: Innovations of Jing-Ching Lin: A Solder-Ball Supplying Revolution

Introduction

Jing-Ching Lin, an accomplished inventor based in Hsinchu, Taiwan, has made significant contributions in the field of industrial technology. Currently associated with the Industrial Technology Research Institute, he holds a patent that exemplifies his innovative spirit and technical expertise.

Latest Patents

Jing-Ching Lin's notable patent, titled "Solder-ball supplying apparatus," addresses the intricacies of the ball-grid array (BGA) IC packaging process. This ingenious apparatus is designed to supply solder balls with diameters ranging from 0.5 mm to 1.0 mm in a controlled and automated manner. Utilizing advanced vacuum mechanisms, the apparatus efficiently extracts a predetermined amount of solder balls from a storage tank to facilitate their transfer to a solder-ball implanting machine. Furthermore, the integration of rotary pneumatic cylinder means and valve systems ensures that the conveyance process is swift and non-contact, thereby preventing any potential damage to the delicate solder balls.

Career Highlights

Throughout his career at the Industrial Technology Research Institute, Jing-Ching Lin has demonstrated a relentless pursuit of innovation. His work on the solder-ball supplying apparatus reflects not only his technical proficiency but also his dedication to improving manufacturing processes. By automating solder ball supply, he has contributed to reducing manual labor and enhancing the quality assurance of the components used in electronic applications.

Collaborations

Jing-Ching Lin collaborates closely with several talented colleagues, including Ching-Lin Lin and Meng-Chun Chen. Their collective expertise fosters a dynamic environment that encourages groundbreaking ideas and the development of innovative solutions within their research projects.

Conclusion

In conclusion, Jing-Ching Lin's innovative contributions to the field of industrial technology, particularly through his patent for a solder-ball supplying apparatus, highlight the significance of automation in enhancing manufacturing efficiency and quality. As part of the Industrial Technology Research Institute, his continued work promises to advance the capabilities of electronic component production.

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