The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 09, 1999
Filed:
Jun. 23, 1997
Ching-Lin Lin, Hsinchu, TW;
Meng-Chun Chen, Tainan, TW;
Chen-Chung Du, Hsinchu, TW;
Jing-Ching Lin, Hsinchu, TW;
Chyi-Liou Lin, Hsinchu, TW;
Industrial Technology Research Institute, Hsinchu, TW;
Abstract
A solder-ball supplying apparatus for a ball-grid array (BGA) IC packaging process is provided, which can supply solder balls of diameters from 0.5 mm to 1.0 mm at a preset amount to a solder-ball implanting machine. The solder-ball supplying apparatus is fully automated, in which vacuum means is used to suck out a preset amount of solder balls from a storage tank that are to be supplied. Rotary pneumatic cylinder means in conjunction with valve means are used to control the conveyance of the solder balls to the container. This solder-ball supplying apparatus can supply solder balls fast and in a non-contact manner that can prevent damage to the solder balls being supplied. It is fully automated so that manual labor is reduced and the quality of the solder balls being supplied can be assured.