This inventor holds 1 USPTO granted patent. Top assignee: Jiangsu University of Science and Technology. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Innovations of Jinfeng Liu in Ship Construction
Introduction
Jinfeng Liu is a notable inventor based in Jiangsu, China. He has made significant contributions to the field of ship construction through his innovative patent. His work focuses on addressing challenges related to curved surface deformation in ship segmental construction.
Latest Patents
Jinfeng Liu holds a patent titled "Dynamic compensation method for curved surface deformation in ship segmental construction." This method involves fitting a curved surface and building a segmental deformation compensation model based on the actual segmentation of a ship. The goal is to obtain a theoretical height of a jig frame. The process establishes a correlation between jig frames based on the ship's segmental deformation range and the compression load. It also performs segmental deformation compensation by adopting a preset adaptive regulation and control algorithm of jig frame height. This innovative approach creates a correlation between a reference jig frame and slave jig frames at each level.
Career Highlights
Jinfeng Liu is affiliated with Jiangsu University of Science and Technology, where he continues to advance his research and innovations in ship construction. His work has garnered attention for its practical applications in the industry.
Collaborations
Jinfeng Liu collaborates with esteemed colleagues, including Honggen Zhou and Xuwen Jing, who contribute to his research endeavors. Their combined expertise enhances the quality and impact of their work.
Conclusion
Jinfeng Liu's innovative contributions to ship construction through his dynamic compensation method demonstrate his commitment to advancing engineering solutions. His work not only addresses practical challenges but also sets a foundation for future innovations in the field.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile