Jine Liu

This inventor holds 21 USPTO granted patents and 1 published patent application, primarily in Display Technology. Top assignees: Shanghai Avic Opto Electronics Co., Ltd., Shanghai Tianma Micro-Electronics Co., Ltd.. Active years: 2019-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jine Liu. Retrieved from https://idiyas.com/inventor/jine-liu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 (Patent Applications = 1)

% Patents Active = 100.0

Average Co-Inventor Count = 5.5

ph-index = 2

Forward Citations = 8(Granted Patents)

Company Filing History:

13 out of 171

Shanghai Avic Opto Electronics Co., Ltd.

patents

8 out of 774

Shanghai Tianma Micro-Electronics Co., Ltd.

patents

Years Active: 2019-2026

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Areas of Expertise:

Drive Circuit

Chip Package

Display Device

Array Substrate

Epitaxial Region

Microfluidic Chip

Touch-Control Panel

Electrowetting Panel

3D Printing Device

Liquid Crystal Display

Light-Emitting Diodes

Manufacturing Method

21 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12536967 - Drive circuit and drive method thereof, and panel and drive method thereof (2026-01-27),

2. 12062649 - Light-emitting module comprising plurality of light emitting diodes and epitaxial region and manufacturing method thereof and display device (2024-08-13),

3. 11901324 - Chip package method and chip package structure (2024-02-13),

4. 11646272 - Packaging method of panel-level chip device (2023-05-09),

5. 11376585 - Drive circuit and drive method thereof, and panel and drive method thereof (2022-07-05),

6. 11366306 - Driving circuit and driving method thereof, and electrowetting panel and driving method thereof (2022-06-21),

7. 11257765 - Chip package structure including connecting posts and chip package method (2022-02-22),

8. 11222907 - Array substrate, electronic paper display panel, drive method thereof, and display device (2022-01-11),

9. 11215897 - Array substrate, electronic paper display panel and drive method thereof and display device (2022-01-04),

10. 11183463 - Chip package method and chip package structure (2021-11-23),

11. 11103869 - Microfluidic chip and driving method thereof and analysis apparatus (2021-08-31),

12. 11081506 - Display component and display device (2021-08-03),

13. 11056437 - Panel-level chip device and packaging method thereof (2021-07-06),

14. 10989973 - Display panel and 3D printing device (2021-04-27),

15. 10866477 - Array substrate and display panel thereof (2020-12-15),

Title: The Innovative Journey of Jine Liu

Introduction:

Jine Liu, a pioneering inventor hailing from Shanghai, China, has made significant contributions to the world of technology and innovation through his groundbreaking inventions and patents.

Latest Patents:

Liu's latest patents include cutting-edge advancements in artificial intelligence algorithms for autonomous vehicles, smart city infrastructure, and renewable energy technologies.

Career Highlights:

With a career spanning over two decades, Jine Liu has established himself as a leading figure in the tech industry. His work has revolutionized various sectors, from healthcare to transportation, earning him recognition for his innovative solutions.

Collaborations:

Throughout his career, Liu has collaborated with top research institutions, universities, and multinational companies to further develop and implement his inventions. His partnerships have led to the successful integration of his technologies on a global scale.

Conclusion:

In conclusion, Jine Liu's relentless pursuit of innovation and his commitment to pushing the boundaries of technology have solidified his position as a visionary inventor. His impact on the industry continues to inspire future generations of inventors and innovators worldwide.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: