Jinchao Dong

Title: Jinchao Dong: Innovator in Resin Composition Technology

Introduction

Jinchao Dong is a notable inventor based in Dongguan, China. He has made significant contributions to the field of resin compositions, particularly in the development of materials used in electronic applications. His innovative work has led to the creation of a patented resin composition that enhances the performance of adhesive films and copper foils.

Latest Patents

Jinchao Dong holds a patent for a resin composition and its use, which includes a unique formulation comprising 40-70% of a crosslinkable and curable resin and 30-60% of a filler. The filler used is silicon dioxide, prepared through an organosilicone hydrolysis method. This composition is designed to achieve a higher elongation rate, improved peel strength, low coefficient of thermal expansion (CTE), and better drilling processability. The resin composition is particularly beneficial for printed circuit board materials, especially multilayer laminates with fine line processing capabilities.

Career Highlights

Jinchao Dong is associated with Shengyi Technology Co., Ltd., where he applies his expertise in resin technology. His work has been instrumental in advancing the capabilities of materials used in the electronics industry. With a focus on innovation, he continues to contribute to the development of high-performance materials.

Collaborations

Jinchao Dong collaborates with his coworker, Qing Wang, to further enhance the research and development of resin compositions. Their combined efforts aim to push the boundaries of material science in electronic applications.

Conclusion

Jinchao Dong's contributions to resin composition technology exemplify the impact of innovative thinking in the electronics industry. His patented work not only improves material performance but also opens new avenues for future advancements.