Seongnam-si, South Korea

Jin Sung Chun


Average Co-Inventor Count = 4.6

ph-index = 1


Company Filing History:


Years Active: 2021-2024

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3 patents (USPTO):Explore Patents

Title: Innovations of Jin Sung Chun

Introduction

Jin Sung Chun is a notable inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of substrate processing and atomic layer etching, holding a total of three patents. His work is characterized by innovative methods that enhance the efficiency and effectiveness of substrate processing technologies.

Latest Patents

One of his latest patents is a substrate processing method that utilizes a substrate processing apparatus. This apparatus includes a process chamber that defines a processing space, a substrate support for placing the substrate, a gas sprayer for supplying process gas, and a remote plasma generator. The method involves placing the substrate on the support, continuously supplying a surface processing gas, and activating it with plasma power before supplying an etching gas.

Another significant patent is an atomic layer etching method designed for etching the surface of a substrate. This method employs an atomic layer etching apparatus that features a sealed process chamber and a gas injection unit. The process includes preparing the substrate, modifying its surface layer using a radicalized modification gas, and purging the surface layer before removing it with a metal-containing precursor.

Career Highlights

Jin Sung Chun is currently employed at Wonik Ips Co., Ltd., where he continues to develop innovative technologies in substrate processing. His expertise in this area has positioned him as a key figure in advancing the capabilities of etching methods.

Collaborations

He collaborates with notable coworkers, including Kwang Seon Jin and Byung Chul Cho, who contribute to the innovative projects at Wonik Ips Co., Ltd. Their combined efforts enhance the research and development initiatives within the company.

Conclusion

Jin Sung Chun's contributions to substrate processing and atomic layer etching reflect his commitment to innovation in the field. His patents demonstrate a deep understanding of the technologies involved and a drive to improve existing methods.

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