Wonik Ips Co., Ltd.

Jin Sung Chun

Byung Chul Cho

Kwang Seon Jin

Sang Jun Park

Jun Hyuck Kwon

In Hwan Yi

A substrate processing method uses a substrate processing apparatus including a process chamber defining a processing space in the process chamber, a substrate support mounted in the process chamber to place a substrate on the substrate support, a gas sprayer for supplying a process gas onto the substrate support in the processing space, and a remote plasma generator connected to the process chamber. The method includes placing the substrate on the substrate support, continuously supplying a surface processing gas through the remote plasma generator onto the substrate, continuously supplying a purge gas onto the substrate, supplying plasma power to the remote plasma generator to activate the surface processing gas and supply the activated surface processing gas onto the substrate, and cutting off the plasma power supplied to the remote plasma generator and supplying an etching gas onto the substrate.

Substrate processing method

The present invention relates to an atomic layer etching method for etching a surface of a substrate by using an atomic layer etching apparatus. The present invention provides an atomic layer etching method by using an atomic layer etching apparatus including a process chamber having a sealed process space, a gas injection unit installed at an upper side in the process chamber to inject a gas into the process space, a substrate support installed at a lower side in the process chamber and on which a substrate is seated, and a remote plasma generation device, the atomic layer etching method including: a substrate preparing process (S) of preparing a substrate () on the substrate support; a modification process (S) of modifying a surface layer () of the substrate () by radicalizing a modification gas containing a halogen gas except hydrogen fluoride (HF) through the remote plasma generation device coupled to the process chamber and supplying the radicalized modification gas onto the substrate () after the substrate preparing process (S); a first purge process (S) of purging the surface layer; a surface layer removal process (S) of removing the surface layer () modified in the modification process (S) by supplying a metal-containing precursor to the surface layer (); and a second purge process (S) of purging a surface of the substrate ().

Atomic layer etching method

Disclosed is a technology relating to a method for fabricating a multilayer structure. In the method for fabricating the multilayer structure according to the disclosed embodiment, a first material layer including at least one atomic layer is deposited using a first source gas, which includes a first component, and an oxygen-containing reactive gas which is reactive with the first source gas. On the first material layer, a second material layer including at least one atomic layer is deposited using a second source gas, which includes a second component different from the first component, and an oxygen-containing reactive gas which is reactive with the second source gas. The step of depositing the first material layer and the step of depositing the second material layer constitute one cycle, and the cycle is performed at least once.

Growing community of inventors

Seongnam-si, South Korea

Jin Sung Chun