Daejeon, South Korea

Jin Seo Min

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Xinmei Fontana Holding (Hong Kong) Limited. Active years: 2026.

USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Innovations of Jin Seo Min in Pressure-Sensitive Adhesives

Introduction

Jin Seo Min is a notable inventor based in Daejeon, South Korea. He has made significant contributions to the field of pressure-sensitive adhesives, particularly in applications for flexible devices. His innovative work has garnered attention for its reliability and effectiveness in various applications.

Latest Patents

Jin Seo Min holds a patent for a pressure-sensitive adhesive that exhibits excellent reliability. This adhesive is designed for use in flexible devices, effectively responding to repeated deformation and recovery. It prevents defects such as deformation traces before and after deformation. The adhesive also boasts excellent cuttability, workability, and recoverability, while avoiding issues like lifting, delamination, and bubble generation. Additionally, his patent includes the development of a pressure-sensitive adhesive film or optical film, which can be utilized in foldable or rollable devices.

Career Highlights

Jin Seo Min is currently associated with Xinmei Fontana Holding (Hong Kong) Limited, where he continues to innovate in the field of adhesives. His work is characterized by a commitment to enhancing the performance and reliability of adhesive materials in modern technology.

Collaborations

Throughout his career, Jin Seo Min has collaborated with talented individuals such as Hui Je Lee and Hyun Woo Choi. These collaborations have contributed to the advancement of his research and the successful development of his patented technologies.

Conclusion

Jin Seo Min's contributions to the field of pressure-sensitive adhesives highlight his innovative spirit and dedication to improving flexible device technology. His work not only addresses current challenges but also paves the way for future advancements in adhesive applications.

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