Jin-Peng Liu

Title: Innovations of Jin-Peng Liu in Heat Pipe Technology

Introduction

Jin-Peng Liu is a notable inventor based in Kunshan, China, recognized for his contributions to heat pipe technology. With a total of five patents to his name, Liu has made significant advancements in the design and manufacturing of flat heat pipes, which are essential components in various thermal management applications.

Latest Patents

Liu's latest patents include an exemplary flat heat pipe that features a hollow, flattened casing. This innovative design incorporates a first wick structure formed by weaving wires and a second wick structure made of sintered metal powder. The casing consists of a top plate and a bottom plate, with the wick structures positioned at the inner sides of these plates. The two wick structures are in contact with each other, and the casing defines two vapor channels at opposite lateral sides of the combined wick structures. Additionally, Liu has developed a method for manufacturing this advanced heat pipe, further showcasing his expertise in the field.

Career Highlights

Throughout his career, Jin-Peng Liu has worked with prominent companies such as Furui Precise Component (Kunshan) Co., Ltd. and Foxconn Technology Co., Ltd. His experience in these organizations has allowed him to refine his skills and contribute to the development of innovative thermal solutions.

Collaborations

Liu has collaborated with talented individuals in the industry, including Sheng-Liang Dai and Yue Liu. These partnerships have fostered a creative environment that has led to the successful development of his patented technologies.

Conclusion

Jin-Peng Liu's work in heat pipe technology exemplifies the spirit of innovation and dedication to advancing thermal management solutions. His patents and collaborations reflect his commitment to improving efficiency in various applications.