Seongnam, South Korea

Jin-Kook Jeong

This inventor holds 1 USPTO granted patent. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jin-Kook Jeong. Retrieved from https://idiyas.com/inventor/jin-kook-jeong-ypodpcaq

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:


Years Active: 2010

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1 patent (USPTO):Explore Patents

Title: Innovations of Jin-Kook Jeong

Introduction

Jin-Kook Jeong is a notable inventor based in Seongnam-si, South Korea. He has made significant contributions to the field of memory chip technology. His innovative approach has led to the development of a unique repair method for multi-chip systems.

Latest Patents

Jin-Kook Jeong holds a patent for a "Multi-chip and repairing method based on remaining redundancy cells." This patent outlines a repair method for a multi-chip system that includes several memory chips. Each memory chip stores information regarding remaining redundancy cells after undergoing repairs at the chip level. The method involves testing one of the memory chips, determining if it is defective, and checking its repairability based on the stored information. If the chip is deemed repairable, the method allows for its repair.

Career Highlights

Jin-Kook Jeong is currently employed at Samsung Electronics Co., Ltd., a leading company in the technology sector. His work focuses on enhancing the reliability and efficiency of memory chips, which are crucial components in various electronic devices.

Collaborations

Jin-Kook Jeong collaborates with Byeong-Yun Kim, a talented female engineer. Together, they work on advancing technologies that improve memory chip performance and reliability.

Conclusion

Jin-Kook Jeong's innovative contributions to memory chip technology demonstrate his expertise and commitment to advancing the field. His patent reflects a significant step forward in the repair methods for multi-chip systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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