Jin-Hua Huang

Title: Innovations of Jin-Hua Huang in Surface Acoustic Wave Technology.

Introduction

Jin-Hua Huang is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of surface acoustic wave technology. His innovative work has led to the development of a unique substrate that enhances the performance of acoustic wave devices.

Latest Patents

Jin-Hua Huang holds a patent for a surface acoustic wave substrate. This substrate includes a diamond layer, a piezoelectric layer made of aluminum nitride, and a titanium nitride-based buffer layer. The buffer layer is sandwiched between the diamond layer and the piezoelectric layer. Notably, the titanium nitride-based buffer layer features a graded structure or consists of a first sub-layer of titanium and a second sub-layer of titanium nitride, which is positioned between the first sub-layer and the piezoelectric layer. This innovative design aims to improve the efficiency and effectiveness of surface acoustic wave devices.

Career Highlights

Jin-Hua Huang is affiliated with Tamkang University, where he continues to engage in research and development in his field. His work has garnered attention for its potential applications in various technologies, including telecommunications and sensor systems.

Collaborations

Some of his notable coworkers include I-Nan Lin and Cheng-Hsien Chou. Their collaborative efforts contribute to the advancement of research in surface acoustic wave technology.

Conclusion

Jin-Hua Huang's contributions to surface acoustic wave technology exemplify the innovative spirit of modern inventors. His patent reflects a significant advancement in the field, showcasing the potential for future developments in acoustic wave applications.