Hong Kong, China

Jimmy Chun Wah Kwok


Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 26(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: The Innovations of Jimmy Chun Wah Kwok

Introduction

Jimmy Chun Wah Kwok is a notable inventor based in Hong Kong, CN. He has made significant contributions to the field of electronic packaging. His innovative approach has led to the development of a unique patent that addresses the challenges in this industry.

Latest Patents

Kwok holds a patent for an "Ultra-thin composite surface finish for electronic packaging." This invention involves a packaged electronic device that includes at least one electronic device and leads sealed within a protective package. The leads consist of a conductive metal substrate featuring a composite metal finish with a total thickness of 1000 Å or less. The finish comprises, in succession from the substrate, 25-750 Å of palladium alloy and 5-250 Å of wirebondable and solderable material. The substrate is preferably nickel-plated copper alloy or Fe–Ni alloy. The palladium content in the palladium alloy coating can range from 10-95 weight percent. This innovative finish meets the requirements of wirebonding and solderability at a thickness surprisingly lower than previously used packaging finishes.

Career Highlights

Kwok has had a distinguished career, working with Lucent Technologies Inc. His expertise in electronic packaging has positioned him as a key player in the industry. His innovative solutions have contributed to advancements in technology and manufacturing processes.

Collaborations

Throughout his career, Kwok has collaborated with notable colleagues, including Joseph Anthony Abys and Alan Blair. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.

Conclusion

Jimmy Chun Wah Kwok is a prominent inventor whose work in electronic packaging has led to significant advancements in the field. His patent for an ultra-thin composite surface finish exemplifies his innovative spirit and commitment to improving technology. His contributions continue to influence the industry and inspire future innovations.

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