The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 17, 2002
Filed:
Nov. 06, 2000
Joseph Anthony Abys, Warren, NJ (US);
Alan Blair, Murray Hill, NJ (US);
Chonglun Fan, Bridgewater, NJ (US);
Chen Xu, New Providence, NJ (US);
Jimmy Chun Wah Kwok, Kowloon, HK;
Lucent Technologies Inc., Murray Hill, NJ (US);
Abstract
In accordance with the invention, a packaged electronic device comprises at least one electronic device and leads sealed within a protective package. The leads comprise a conductive metal substrate having a composite metal finish with a total thickness of 1000 Å or less. The finish comprises, in succession from the substrate, 25-750 Å of palladium alloy and 5-250 Å of wirebondable and solderable material. The substrate is advantageously nickel-plated copper alloy or Fe—Ni alloy. The content of palladium in the palladium alloy coating can range from 10-95 weight percent. This finish meets requirements of wirebonding and solderability at a thickness surprisingly lower than previously used packaging finishes.