Company Filing History:
Years Active: 2022
Title: Jiin Yu - Innovator in Semiconductor Packaging
Introduction
Jiin Yu is a notable inventor based in Cheonan-si, South Korea. She has made significant contributions to the field of semiconductor technology, particularly in the design and packaging of semiconductor chips. Her innovative approach has led to advancements that enhance the performance and reliability of electronic devices.
Latest Patents
Jiin Yu holds a patent for a unique semiconductor package. This package includes a first semiconductor chip and a second semiconductor chip positioned on top of the first. An adhesive layer is strategically placed between the two chips. The first semiconductor chip features a semiconductor substrate along with multiple protection layers. Notably, the topmost layer of these protection layers has a surface with both convex and concave portions, which interact with the adhesive layer. This design aims to improve the overall functionality and durability of semiconductor packages.
Career Highlights
Jiin Yu is currently employed at Samsung Electronics Co., Ltd., a leading company in the electronics industry. Her work at Samsung has allowed her to collaborate with some of the brightest minds in the field, contributing to groundbreaking innovations in semiconductor technology.
Collaborations
Throughout her career, Jiin has worked alongside talented colleagues, including Yongjin Park and Jin-San Jung. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Jiin Yu's contributions to semiconductor packaging exemplify her innovative spirit and dedication to advancing technology. Her patent reflects her expertise and commitment to improving electronic devices, making her a valuable asset in the field of semiconductor engineering.