The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2022
Filed:
Mar. 15, 2021
Applicant:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Inventors:
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/00 (2006.01); H01L 23/48 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 23/481 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 2224/32056 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/83007 (2013.01);
Abstract
A semiconductor package may include a first semiconductor chip, a second semiconductor chip on the first semiconductor chip, and an adhesive layer between the first semiconductor chip and the second semiconductor chip. The first semiconductor chip may include a semiconductor substrate and a plurality of protection layers on the semiconductor substrate. The topmost layer of the protection layers may have a top surface with convex portions and concave portions, and the convex portions and the concave portions may be in contact with the adhesive layer.