Perak, Malaysia

Jiew Poh Liew

This inventor holds 1 USPTO granted patent. Top assignee: Voith Paper Patent Gmbh. Active years: 2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jiew Poh Liew. Retrieved from https://idiyas.com/inventor/jiew-poh-liew

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2009

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1 patent (USPTO):Explore Patents

Title: Jiew Poh Liew: Innovator in Papermachine Fabric Cleaning Technology

Introduction

Jiew Poh Liew is a notable inventor based in Perak, Malaysia. She has made significant contributions to the field of papermaking through her innovative designs and solutions. Her work focuses on improving the efficiency and effectiveness of cleaning processes in paper production.

Latest Patents

Jiew Poh Liew holds a patent for an "Apparatus for cleaning a papermachine fabric." This apparatus features a device designed to remove contaminants from a fabric. The device includes a contact surface that interacts with at least the outer side of the fabric, allowing contaminants to be transferred from the fabric to the contact surface. This invention is particularly beneficial for cleaning dryer fabrics that have sticky or tacky contaminants, enhancing the overall efficiency of paper production.

Career Highlights

Jiew Poh Liew is currently employed at Voith Paper Patent GmbH, where she continues to develop innovative solutions for the papermaking industry. Her expertise and dedication have positioned her as a key player in her field.

Collaborations

Some of her notable coworkers include Antony Morton and Dwight Payne, who contribute to the collaborative environment at Voith Paper Patent GmbH.

Conclusion

Jiew Poh Liew's contributions to the papermaking industry through her innovative cleaning apparatus demonstrate her commitment to enhancing production processes. Her work not only addresses current challenges but also paves the way for future advancements in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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