Taipei, Taiwan

Jieh-I Taur

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Dell Products Inc.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jieh-I Taur. Retrieved from https://idiyas.com/inventor/jieh-i-taur

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Jieh-I Taur and Thermal Management Innovation.

Introduction

Jieh-I Taur is an inventor associated with Taipei, Taiwan. His recorded patent work concerns a carrier device designed to support thermal management in an information handling system.

Latest Patents

The available information lists one patent for Taur: “Carrier Device for a Thermal Pad of an Information Handling System.” The invention describes a carrier with a first adhesive surface coupled to a thermal pad, which absorbs heat from a first component. A thermal transfer window allows heat to pass from the pad toward a second component, while a second adhesive surface removably attaches to that component. The design provides a way to position a thermal pad and facilitate heat transfer between system components.

Career Highlights

Taur is associated with Dell Products Inc. The supplied record credits him with 1 patent, focused on a component for thermal management in information handling systems.

Collaborations

The listed coworkers associated with Taur are Hui-Huan Chien and Bo-Wei Chu. Their names are provided as collaborators, though the available details do not specify their roles in the patent.

Conclusion

Jieh-I Taur’s recorded invention addresses heat transfer within information handling systems through an adhesive carrier and thermal transfer window, reflecting a practical approach to device thermal management.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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