Jie Lin Hung

Title: Jie Lin Hung: Innovator in Touch Assembly Technology

Introduction

Jie Lin Hung is a notable inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of touch assembly technology. His innovative approach has led to the development of a unique patent that enhances the functionality and manufacturing process of touch assemblies.

Latest Patents

Jie Lin Hung holds a patent for a "Touch assembly and method of manufacturing the same." This invention includes a protective cover, a first adhesive layer, a plurality of curved wires, and a second adhesive layer. The first adhesive layer is positioned on the protective cover, with a thickness ranging from 20 μm to 200 μm. The initial tack of this layer varies from 1800 gf/in to 4000 gf/in. The curved wires are arranged on the first adhesive layer, consisting of two groups that extend in different directions and overlap each other. Each wire features a conductive inner core and a covering layer, while the second adhesive layer encapsulates both the curved wires and the first adhesive layer. This innovative design improves the efficiency and effectiveness of touch assemblies.

Career Highlights

Jie Lin Hung is currently associated with Tpk Glass Solutions (Xiamen) Inc., where he continues to work on advancements in touch technology. His expertise and innovative mindset have positioned him as a key player in the industry.

Collaborations

Some of his notable coworkers include Li Huang Tsai and Lien Hsin Lee, who contribute to the collaborative environment that fosters innovation at Tpk Glass Solutions.

Conclusion

Jie Lin Hung's contributions to touch assembly technology exemplify the spirit of innovation. His patent reflects a significant advancement in the field, showcasing his dedication to improving technology. His work continues to influence the industry positively.