Shanghai, China

Jibang Yang

This inventor holds 1 USPTO granted patent. Top assignee: Illinois Tool Works Inc.. Active years: 2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jibang Yang. Retrieved from https://idiyas.com/inventor/jibang-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2023

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1 patent (USPTO):Explore Patents

Title: Jibang Yang - Innovator in Ventilation Technology

Introduction

Jibang Yang is a notable inventor based in Shanghai, China. He has made significant contributions to the field of ventilation technology. His innovative designs aim to improve air circulation and efficiency in various applications.

Latest Patents

Jibang Yang holds a patent for a "Vent device having one or more stage ventilation assemblies." This vent device includes at least one stage ventilation assembly, which consists of an inner layer element and an outer layer element. An air duct is formed between these elements, featuring an air duct outlet. Each stage of the assembly can transition between an open and closed position, allowing for controlled airflow. In the closed position, the inner layer element seals the air duct outlet, while in the open position, it allows air to flow freely.

Career Highlights

Jibang Yang is currently employed at Illinois Tool Works Inc., where he continues to develop innovative solutions in ventilation technology. His work has garnered attention for its practical applications and efficiency improvements.

Collaborations

Jibang Yang collaborates with Jie Yu, a fellow innovator, to enhance their projects and share insights in their field.

Conclusion

Jibang Yang's contributions to ventilation technology exemplify the spirit of innovation. His patent and ongoing work at Illinois Tool Works Inc. highlight his commitment to improving air circulation systems.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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