Beijing, China

Jiapeng Jia


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2024

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1 patent (USPTO):Explore Patents

Title: Innovations of Jiapeng Jia in Image Segmentation Technology

Introduction

Jiapeng Jia, an accomplished inventor based in Beijing, China, has made significant contributions to the field of image processing. He holds a total of one patent, which showcases his expertise and innovative thinking in the development of advanced methods for processing cadmium zinc telluride (CZT) chips.

Latest Patents

Jiapeng Jia's notable patent is titled "Multi-angle image semantic segmentation method for cadmium zinc telluride chips." This inventive method addresses the challenges associated with image quality in the field of semiconductor materials. The patent describes a sophisticated process wherein an n+1 dataset is constructed using acquired CZT images. The approach utilizes a Pixel Aggregation Network (PAN) and a Latent Aggregation Network (LAN) within a Progressive Complementary Knowledge Aggregation network (PCKA), significantly enhancing both the quality and speed of CZT image segmentation. This technology is particularly useful for applications requiring multi-angle image acquisition and semantic segmentation.

Career Highlights

Throughout his career, Jiapeng Jia has honed his skills and expertise working at reputable institutions. He has been associated with Beijing Jiaotong University and Taiyuan University of Science and Technology, contributing to research and development in image processing technologies.

Collaborations

During his professional journey, Jiapeng Jia has collaborated with notable individuals such as Peihao Li and Huihui Bai. These partnerships have allowed him to leverage diverse knowledge and expertise in the realm of image segmentation and enhance the impact of his work.

Conclusion

In summary, Jiapeng Jia stands out as an innovative inventor, particularly in the area of multi-angle image segmentation for cadmium zinc telluride chips. His contributions reflect a commitment to advancing technology in image quality enhancement, paving the way for improvements in semiconductor material applications. As he continues his work in this field, the implications of his innovations are expected to resonate across various technological domains.

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