The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 24, 2024

Filed:

Aug. 27, 2024
Applicants:

Beijing Jiaotong University, Beijing, CN;

Taiyuan University of Science and Technology, Taiyuan, CN;

Shanxi Zhishi Haotai Technology Co., Ltd, Taiyuan, CN;

Inventors:

Peihao Li, Beijing, CN;

Huihui Bai, Beijing, CN;

Yunchao Wei, Beijing, CN;

Yao Zhao, Beijing, CN;

Anhong Wang, Beijing, CN;

Jiapeng Jia, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06V 10/00 (2022.01); G06T 7/00 (2017.01); G06V 10/141 (2022.01); G06V 10/26 (2022.01); G06V 10/774 (2022.01); G06V 10/82 (2022.01); G06V 20/70 (2022.01);
U.S. Cl.
CPC ...
G06V 10/26 (2022.01); G06T 7/0004 (2013.01); G06V 10/141 (2022.01); G06V 10/774 (2022.01); G06V 10/82 (2022.01); G06V 20/70 (2022.01); G06T 2207/20081 (2013.01); G06T 2207/20084 (2013.01); G06T 2207/30148 (2013.01);
Abstract

Disclosed is a multi-angle image semantic segmentation method for cadmium zinc telluride chips, belonging to the field of image quality augmentation. Firstly, construction of an n+1 dataset is performed by using acquire CZT images, and then pixel-level and latent-level knowledge representation is performed through a Pixel Aggregation Network PAN and a Latent Aggregation Network LAN in a Progressive Complementary Knowledge Aggregation network PCKA, which ultimately improves the quality and speed of CZT image segmentation. The method is suitable for applications that require multi-angle image acquisition and semantic segmentation, such as semiconductor material segmentation.


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