Dongguan, China

Jianyu Long

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Dongguan University of Technology. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jianyu Long. Retrieved from https://idiyas.com/inventor/jianyu-long

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: Innovations by Jianyu Long in Automatic Packaging Technology.

Introduction

Jianyu Long is an accomplished inventor based in Dongguan, China. He has made significant contributions to the field of automatic packaging technology. His innovative approach has led to the development of a unique patent that enhances production efficiency in packaging processes.

Latest Patents

Jianyu Long holds a patent for a "Cutter blade dual side film sealing and packing assembly." This invention relates to an automatic packaging device that includes a rack and a power control box. The device features a cutter blade transportation system, lower and upper film feeding devices, and a film sealing mechanism. The design allows for automatic feeding and sealing of blades, significantly improving the efficiency of the packaging process.

Career Highlights

Jianyu Long is affiliated with Dongguan University of Technology, where he continues to innovate and contribute to research in packaging technology. His work has been recognized for its potential to streamline production processes in various industries.

Collaborations

Jianyu Long collaborates with notable colleagues such as Jun Deng and Yun Bai, who share his passion for advancing technology in packaging.

Conclusion

Jianyu Long's contributions to automatic packaging technology exemplify the impact of innovative thinking in enhancing production efficiency. His patent reflects a commitment to improving industrial processes through automation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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