Suzhou, China

Jianxin Wang

This inventor holds 1 USPTO granted patent. Top assignee: Tesa Se. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jianxin Wang. Retrieved from https://idiyas.com/inventor/jianxin-wang-wya4vhqm

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

Average Co-Inventor Count = 1.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jianxin Wang and a Thermal-Activated, Peelable Adhesive Tape.

Introduction

Jianxin Wang is an inventor associated with Tesa SE in Suzhou, China. His patent work includes a thermal-activated, peelable adhesive tape designed to combine secure adhesion with heat-triggered release.

Latest Patents

Wang is associated with 1 patent, titled “Thermal-Activated, Peelable Adhesive Tape.” The invention describes a tape with first and second adhesive layers on its upper and lower surfaces, with reinforcement and a thermally activated layer positioned between them. The thermally activated layer is made from a thermoplastic polymer, which may include ethylene-vinyl acetate copolymer, modified polyolefin, ethylene acrylic acid copolymer, ethylene terpolymer, polyamide copolymer, poly(trans-1,4-isoprene), polyethylene oxide, or a combination of these materials. The patent also describes embodiments with a melting point from 60°C to 150°C and a molecular weight from 1,000 to 1,000,000.

Career Highlights

Wang’s listed patent reflects work on adhesive materials and tape construction. The design uses heat-responsive thermoplastic material to support peelability, while reinforcement layers can contribute to the tape’s structure.

Collaborations

Wang’s listed coworkers include Min Cao and Shuang Wang. His work is associated with Tesa SE.

Conclusion

Jianxin Wang’s patent focuses on a layered adhesive tape that uses a thermally activated polymer to enable controlled peeling, highlighting his contribution to adhesive-material innovation.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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