Dongguan, China

Jianshuang Wen

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Huawei Technologies Co., Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jianshuang Wen. Retrieved from https://idiyas.com/inventor/jianshuang-wen

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Jianshuang Wen and Connector Signal Integrity

Introduction

Jianshuang Wen is an inventor based in Dongguan, China. His work includes a connector design intended to support reliable signal transmission in electronic devices. He is associated with Huawei Technologies Co., Ltd.

Latest Patents

The available information lists 1 patent for Wen: “Connector and Electronic Device Having Socket and Plug Assemblies.” The invention describes a socket assembly with a signal port surrounded by a shielding structure, paired with a plug assembly containing a signal terminal and a ground component. When connected, the signal terminal contacts the signal port, while the ground component bonds to the shielding structure. This arrangement is designed to help prevent signal-current return effects, reduce crosstalk resonance, and improve signal transmission integrity.

Career Highlights

Wen’s listed patent focuses on the electrical connection between socket and plug assemblies. By placing shielding around the signal path and bonding it to the plug’s ground component, the design addresses signal integrity in electronic connectors.

Collaborations

Wen is associated with Huawei Technologies Co., Ltd. The provided information also names Tianming Liu and Ziguo Ma as coworkers, though it does not specify their roles in the patent.

Conclusion

Jianshuang Wen’s listed invention applies shielding and grounding to address signal integrity challenges in electronic connectors.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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