Company Filing History:
Years Active: 2005-2008
Title: The Innovations of Jianqi He
Introduction
Jianqi He is a notable inventor based in Gilbert, AZ (US). He has made significant contributions to the field of integrated circuit packaging. With a total of 2 patents, his work has had a considerable impact on technology.
Latest Patents
One of Jianqi He's latest patents is focused on I/O architecture for integrated circuit packages. This innovation involves a circuit package that includes an upper surface with first and second conductive elements. The first conductive elements are designed to receive input/output signals from respective conductive elements of an integrated circuit die. Meanwhile, the second conductive elements receive a first plurality of these input/output signals from the first conductive elements. Additionally, the lower surface of the package features third conductive elements, which are responsible for receiving a second plurality of input/output signals from other first conductive elements.
Career Highlights
Jianqi He is currently employed at Intel Corporation, where he continues to develop innovative solutions in the field of integrated circuits. His expertise and dedication to his work have positioned him as a valuable asset to the company.
Collaborations
Some of Jianqi He's coworkers include Yuan-Liang Li and Michael Walk. Their collaborative efforts contribute to the advancement of technology in their respective fields.
Conclusion
Jianqi He is a prominent inventor whose work in integrated circuit packaging has led to significant advancements in technology. His contributions continue to influence the industry and inspire future innovations.