Kanagawa, Japan

Jianping Wei

This inventor holds 2 USPTO granted patents and 1 EPO patent. Top assignee: Science Park Corporation. Active years: 2008-2010.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jianping Wei. Retrieved from https://idiyas.com/inventor/jianping-wei-2aqwsqkd

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 6.0

ph-index = 1

Forward Citations = 2(Granted Patents)


Company Filing History:


Years Active: 2008-2010

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2 patents (USPTO):Explore Patents

Title: Innovations by Jianping Wei

Introduction

Jianping Wei is a notable inventor based in Kanagawa, Japan. He has made significant contributions to the field of computer technology, particularly in the development of interface drivers that enhance data transfer speeds and integrity.

Latest Patents

Jianping Wei holds two patents. His latest patents include an "Interface driver program for computer and recording medium therefor" and a "Computer interface driver program." Both inventions provide a common interface among device drivers operating in the kernel, which increases data transfer speeds and improves data integrity. The common interface driver operates in kernel mode and facilitates communication between the application program and the device drivers.

Career Highlights

Jianping Wei is currently employed at Science Park Corporation, where he continues to innovate and develop new technologies. His work focuses on improving the efficiency and reliability of computer systems through advanced driver interfaces.

Collaborations

Some of Jianping Wei's coworkers include Koichiro Shoji and Hitoshi Shimura, who contribute to the collaborative environment at Science Park Corporation.

Conclusion

Jianping Wei's contributions to computer technology through his innovative patents demonstrate his commitment to enhancing data transfer and integrity in computing systems. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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