Beijing, China

Jianlin Feng

This inventor holds 1 USPTO granted patent. Top assignees: Boe Technology Group Co., Ltd., Chengdu Boe Optoelectronics Technology Co., Ltd.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jianlin Feng. Retrieved from https://idiyas.com/inventor/jianlin-feng

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: The Innovations of Jianlin Feng

Introduction

Jianlin Feng is a notable inventor based in Beijing, China. He has made significant contributions to the field of substrate handling technology. His innovative approach has led to the development of a unique system for loading and unloading substrates.

Latest Patents

Jianlin Feng holds a patent for a "System for loading and unloading a substrate, method for loading a substrate, and method for unloading a substrate." This system includes a substrate rotation apparatus with two rotation positions, allowing for efficient handling of substrates. The apparatus features two layers of sucker assemblies and a mechanical hand designed to hold and manipulate the substrate effectively.

Career Highlights

Throughout his career, Jianlin Feng has worked with prominent companies such as BOE Technology Group Co., Ltd. and Chengdu BOE Optoelectronics Technology Co., Ltd. His experience in these organizations has contributed to his expertise in substrate technology.

Collaborations

Jianlin Feng has collaborated with notable colleagues, including Dawei Han and Jianjun Lin. Their combined efforts have further advanced the innovations in substrate handling systems.

Conclusion

Jianlin Feng's contributions to substrate technology through his patent and career experiences highlight his role as an influential inventor in the field. His work continues to impact the industry positively.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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