Shenzhen, China

Jianhua Gu

This inventor holds 1 USPTO granted patent. Top assignee: Hon Hai Precision Industry Co., Ltd.. Active years: 2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jianhua Gu. Retrieved from https://idiyas.com/inventor/jianhua-gu-x4hsv8fv

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2004

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1 patent (USPTO):Explore Patents

Title: Innovations of Jianhua Gu

Introduction

Jianhua Gu is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of technology, particularly in the design of mounting assemblies for heat sinks. His innovative approach has led to the development of a patent that enhances the efficiency of electronic packaging.

Latest Patents

Jianhua Gu holds a patent for a "Mounting assembly for heat sink." This invention includes a mounting frame that utilizes two clips and an operating body. Each clip features a central portion with two arms that extend from opposite ends. The design incorporates hooks that engage with retaining holes in the mounting frame, ensuring a secure fit for the heat sink against an electronic package.

Career Highlights

Jianhua Gu is currently employed at Hon Hai Precision Industry Co., Ltd., a leading technology company known for its innovative manufacturing solutions. His work at the company has allowed him to collaborate with other talented professionals in the field.

Collaborations

One of his notable coworkers is Chao Kun Tseng, with whom he has likely shared insights and expertise in their respective projects.

Conclusion

Jianhua Gu's contributions to the field of technology through his patent demonstrate his innovative spirit and commitment to improving electronic packaging solutions. His work continues to influence advancements in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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