Shenzhen, China

Jianhao Shi

This inventor holds 1 USPTO granted patent. Top assignee: Shenzhen Fitech Co., Ltd.. Active years: 2022.


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2022

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1 patent (USPTO):Explore Patents

Title: Innovations of Jianhao Shi in Low-Temperature Soldering

Introduction

Jianhao Shi is a notable inventor based in Shenzhen, China. He has made significant contributions to the field of low-temperature soldering through his innovative work. His expertise lies in developing advanced materials that enhance the reliability and performance of soldered joints.

Latest Patents

Jianhao Shi holds a patent for a micro/nano particle reinforced composite solder and its preparation method. This invention addresses the challenges associated with lead-free low-temperature soldering. The micro/nanoparticle-reinforced tin-based alloy solder powder is created by mixing micro/nano-sized Cu, Ag, and Sb particles with molten metal tin. The mixture is then atomized and blended with low-melting-point SnBi-based alloy solder powder and conventional flux. This innovative approach allows for soldering at temperatures below 200°C, where tin atoms form intermetallic compounds, improving the quality of soldered joints.

Career Highlights

Jianhao Shi is currently employed at Shenzhen Fitech Co., Ltd. His work focuses on developing materials that enhance the performance of soldering processes. His innovative solutions have the potential to revolutionize the manufacturing of electronic components.

Collaborations

Jianhao collaborates with talented coworkers, including Kui Chen and Pu Xu. Their combined expertise contributes to the advancement of soldering technologies and the development of new materials.

Conclusion

Jianhao Shi's contributions to low-temperature soldering through his patented innovations demonstrate his commitment to enhancing manufacturing processes. His work not only addresses existing challenges but also paves the way for future advancements in the field.

Profile summary based on public USPTO records.
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